Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 061466/0661 | |
| Pages: | 6 |
| | Recorded: | 10/19/2022 | | |
| Attorney Dkt #: | 100IM1145US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18047601
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Filing Dt:
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10/18/2022
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Publication #:
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Pub Dt:
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04/20/2023
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Title:
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CHEMICAL MECHANICAL POLISHING SLURRY COMPOSITION FOR POLISHING BORON SILICON COMPOUND, CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME
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Assignees
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUP, GYEONGGI-DO |
| ICHEON, KOREA, REPUBLIC OF 17336 |
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| 222, WANGSIMNI-RO, SEONGDONG-GU |
| SEOUL, KOREA, REPUBLIC OF 04763 |
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Correspondence name and address
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AMPACC LAW GROUP, PLLC
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6100 219TH ST SW #580
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MOUNTLAKE TERRACE, WA 98043
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