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Reel/Frame:061564/0904   Pages: 4
Recorded: 10/27/2022
Attorney Dkt #:052776-0069
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17914251
Filing Dt:
09/23/2022
Publication #:
Pub Dt:
04/13/2023
Title:
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND MANUFACTURING METHOD OF STRUCTURE
Assignors
1
Exec Dt:
08/25/2022
2
Exec Dt:
08/25/2022
Assignee
1
23-23, HONCHO, ITABASHI-KU
TOKYO, JAPAN 173-0001
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
500 NORTH CAPITOL STREET, NW
WASHINGTON, DC 20001

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