Patent Assignment Details
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| Reel/Frame: | 061701/0791 | |
| Pages: | 5 |
| | Recorded: | 11/09/2022 | | |
| Attorney Dkt #: | 0373-0699PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17854474
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Filing Dt:
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06/30/2022
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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GAP FILLING METHOD IN SEMICONDUCTOR MANUFACTURING PROCESS
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100 E
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FALLS CHURCH, VA 22042
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