Patent Assignment Details
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| Reel/Frame: | 061816/0586 | |
| Pages: | 4 |
| | Recorded: | 11/17/2022 | | |
| Attorney Dkt #: | M1295.70389US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17989498
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Filing Dt:
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11/17/2022
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Publication #:
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Pub Dt:
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03/09/2023
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Title:
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CHIP SCALE PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
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Assignee
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| NO. 1, DUSING 1ST RD. |
| HSINCHU SCIENCE PARK |
| HSINCHU CITY 30078, TAIWAN R.O.C. |
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Correspondence name and address
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WOLF, GREENFIELD & SACKS, P.C.
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600 ATLANTIC AVENUE
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BOSTON, MA 02210-2206
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