Patent Assignment Details
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Reel/Frame: | 061837/0785 | |
| Pages: | 8 |
| | Recorded: | 11/21/2022 | | |
Attorney Dkt #: | P190676US01 (42005-2427) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17923734
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Filing Dt:
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11/07/2022
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Publication #:
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Pub Dt:
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06/08/2023
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Title:
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SOLID PLATELETS USED AS FILLER IN A UV CURABLE THERMOSET RESIN TO ENHANCE THE ELECTRICAL INSULATION OF HIGH VOLTAGE CONDUCTOR BARS
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Assignee
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BRUGGERSTRASSE 66 |
BADEN, SWITZERLAND 5400 |
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Correspondence name and address
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ARMSTRONG TEASDALE LLP (42005)
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7700 FORSYTH BOULEVARD
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SUITE 1800
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ST. LOUIS, 63105 UNITED STATES
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05/21/2024 11:58 AM
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