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Reel/Frame:062098/0514   Pages: 5
Recorded: 12/15/2022
Attorney Dkt #:251374-1110
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/26/2023
Application #:
17083599
Filing Dt:
10/29/2020
Publication #:
Pub Dt:
05/13/2021
Title:
HEAT-DISSIPATING COMPONENT FOR MOBILE DEVICE
Assignors
1
Exec Dt:
12/13/2021
2
Exec Dt:
11/25/2021
3
Exec Dt:
11/25/2021
4
Exec Dt:
11/25/2021
5
Exec Dt:
11/18/2021
6
Exec Dt:
11/18/2021
7
Exec Dt:
11/19/2021
Assignee
1
1F., NO.28, R&D 2ND RD., SCIENCE-BASED INDUSTRIAL PARK
HSINCHU CITY, TAIWAN 30076
Correspondence name and address
MCCLURE, QUALEY & RODACK LLP
280 INTERSTATE NORTH CIRCLE
SUITE 550
ATLANTA, GA 30339

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