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Reel/Frame:062196/0793   Pages: 5
Recorded: 12/23/2022
Attorney Dkt #:1012-3436/2019P55662 US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18088238
Filing Dt:
12/23/2022
Publication #:
Pub Dt:
04/27/2023
Title:
LAYER STRUCTURE WITH AN INTERMETALLIC PHASE LAYER AND A CHIP PACKAGE THAT INCLUDES THE LAYER STRUCTURE
Assignors
1
Exec Dt:
12/11/2020
2
Exec Dt:
12/11/2020
3
Exec Dt:
06/01/2021
Assignee
1
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondence name and address
MURPHY, BILAK & HOMILLER, PLLC/INFINEON
P.O. BOX 1959
CARY, NC 27512-1959

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