Patent Assignment Details
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| Reel/Frame: | 062205/0352 | |
| Pages: | 3 |
| | Recorded: | 12/26/2022 | | |
| Attorney Dkt #: | 940.0004_CA7 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18088765
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Filing Dt:
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12/26/2022
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Publication #:
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Pub Dt:
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05/04/2023
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Title:
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COMPOSITION FOR ETCHING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
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Assignee
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| 34, PANGYO-RO 255BEON-GIL, BUNDANG-GU |
| SEONGNAM-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 13486 |
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Correspondence name and address
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JONGKOOK PARK
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5105 CLAYBANK LN
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CENTREVILLE, VA 20120
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05/17/2024 03:24 PM
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