Patent Assignment Details
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| Reel/Frame: | 062385/0877 | |
| Pages: | 3 |
| | Recorded: | 01/17/2023 | | |
| Attorney Dkt #: | P2327US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18154033
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Filing Dt:
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01/12/2023
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Publication #:
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Pub Dt:
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07/20/2023
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Title:
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SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONNECT LAYER FOR HIGH POWER ELECTRONICS
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Assignee
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| UNITS 515-517, 5/F, LAKESIDE 1, NO. 8 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK, SHATIN, NEW TERRITORIES |
| HONG KONG, HONG KONG |
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Correspondence name and address
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IDEA INTELLECTUAL LIMITED
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10/F-1, NO. 70-1, SECTION 1, CHENGDE ROAD
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DATONG DISTRICT
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TAIPEI, 103622 TAIWAN
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