Patent Assignment Details
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| Reel/Frame: | 062452/0910 | |
| Pages: | 5 |
| | Recorded: | 01/23/2023 | | |
| Attorney Dkt #: | 3590-1002DIV |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18100152
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Filing Dt:
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01/23/2023
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Publication #:
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Pub Dt:
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05/25/2023
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Title:
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BONDED SEMICONDUCTOR DIE ASSEMBLY CONTAINING THROUGH-STACK VIA STRUCTURES AND METHODS FOR MAKING THE SAME
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Assignee
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| 5080 SPECTRUM DRIVE |
| SUITE 1050W |
| ADDISON, TEXAS 75001 |
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Correspondence name and address
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THE MARBURY LAW GROUP PLLC
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11800 SUNRISE VALLEY DRIVE
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15TH FL
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RESTON, VA 22192
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