Patent Assignment Details
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| Reel/Frame: | 062487/0652 | |
| Pages: | 3 |
| | Recorded: | 01/25/2023 | | |
| Attorney Dkt #: | 121899-0023CT01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18159173
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Filing Dt:
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01/25/2023
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Publication #:
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Pub Dt:
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05/25/2023
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND DEVICE PROVIDED WITH SEMICONDUCTOR DEVICE
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Assignee
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| 2-1-1, KATAHIRA, AOBA-KU |
| SENDAI-SHI, MIYAGI, JAPAN 9808577 |
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Correspondence name and address
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PROCOPIO, CORY, HARGREAVES & SAVITCH LLP
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525 B STREET, SUITE 2200
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SAN DIEGO, CA 92101
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05/03/2024 07:45 PM
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