Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062504/0923 | |
| Pages: | 14 |
| | Recorded: | 01/27/2023 | | |
| Attorney Dkt #: | FUKA86PUS01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18017970
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Filing Dt:
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01/25/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Title:
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COMPOSITE MATERIAL, HEAT SPREADER AND SEMICONDUCTOR PACKAGE
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Assignees
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU, OSAKA-SHI |
| OSAKA, JAPAN 541-0041 |
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| 11-11, SHIBA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-0014 |
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Correspondence name and address
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RENNER OTTO
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1621 EUCLID AVENUE
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19TH FLOOR
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CLEVELAND, OH 44115
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