Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062512/0343 | |
| Pages: | 7 |
| | Recorded: | 01/25/2023 | | |
| Attorney Dkt #: | 050083-0664 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE OMISSION 3RD INVENTOR'S NAME PREVIOUSLY RECORDED AT REEL: 062119 FRAME: 0621. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/08/2023
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Application #:
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17924649
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Filing Dt:
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11/10/2022
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Publication #:
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Pub Dt:
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07/06/2023
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Assignee
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| 158-1 OAZA SAYAMAGAHARA, IRUMA-SHI |
| SAITAMA, JAPAN 358-0032 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, NW
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WASHINGTON, DC 20001
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