Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062570/0371 | |
| Pages: | 6 |
| | Recorded: | 02/02/2023 | | |
| Attorney Dkt #: | 20371-155879-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18019024
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Filing Dt:
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01/31/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Title:
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PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET, SUITE 2100
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CHICAGO, IL 60603-3406
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