Patent Assignment Details
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| Reel/Frame: | 062574/0720 | |
| Pages: | 8 |
| | Recorded: | 02/02/2023 | | |
| Attorney Dkt #: | 37983.0057U2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18067373
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Filing Dt:
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12/16/2022
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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Systems And Methods For Removing And Replacing Conductive Adhesive Layers Of An Electrode Array
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Assignee
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| PARK 6 |
| ROOT D4, SWITZERLAND 6039 |
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Correspondence name and address
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BALLARD SPAHR LLP
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999 PEACHTREE STREET
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SUITE 1600
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ATLANTA, GA 30309
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05/03/2024 04:28 PM
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