Patent Assignment Details
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| Reel/Frame: | 062593/0592 | |
| Pages: | 3 |
| | Recorded: | 02/06/2023 | | |
| Attorney Dkt #: | 20P0145-CIP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18164614
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Filing Dt:
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02/06/2023
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Publication #:
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Pub Dt:
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06/15/2023
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Title:
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MULTILAYER CORE MOLDING METHOD
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Assignee
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| 2-4-1, HAMAMATSU-CHO |
| MINATO-KU, TOKYO, JAPAN 1056127 |
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Correspondence name and address
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KENJA IP LAW PC
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4 NORTH SECOND STREET, SUITE 598
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SAN JOSE, CA 95113
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04/27/2024 04:44 PM
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