Patent Assignment Details
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Reel/Frame: | 062594/0217 | |
| Pages: | 10 |
| | Recorded: | 02/06/2023 | | |
Attorney Dkt #: | VIIV041-19-DIOD-001-US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/16/2024
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Application #:
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17947673
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Filing Dt:
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09/19/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Title:
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SEMICONDUCTOR PACKAGE AND PACKAGING PROCESS FOR SIDE-WALL PLATING WITH A CONDUCTIVE FILM
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Assignee
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63 LANCASTER AVENUE |
MALVERN, PENNSYLVANIA 19355 |
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Correspondence name and address
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VOLPE KOENIG
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30 S. 17TH STREET
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18TH FLOOR
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PHILADELPHIA, PA 19103
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05/13/2024 03:28 AM
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