Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062692/0048 | |
| Pages: | 8 |
| | Recorded: | 02/14/2023 | | |
| Attorney Dkt #: | 3765-48-10 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18094477
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Filing Dt:
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01/09/2023
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Publication #:
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Pub Dt:
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12/14/2023
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Title:
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DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
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Assignee
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| SUITE 201, 770 PALLADIUM DRIVE |
| KANATA, CANADA K2V 1C8 |
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Correspondence name and address
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MILTONS IP/P.I.
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15 FITZGERALD RD. SUITE 200
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OTTAWA, K2H 9G1 CANADA
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