Patent Assignment Details
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Reel/Frame: | 062712/0444 | |
| Pages: | 6 |
| | Recorded: | 02/15/2023 | | |
Attorney Dkt #: | 010829.9403.US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2024
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Application #:
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18169735
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Filing Dt:
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02/15/2023
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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HIGH DENSITY PILLAR INTERCONNECT CONVERSION WITH STACK TO SUBSTRATE CONNECTION
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Assignee
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8000 S. FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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P.O. BOX 1247
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SEATTLE, WA 98111-1247
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05/16/2024 03:57 PM
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