Patent Assignment Details
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| Reel/Frame: | 062786/0399 | |
| Pages: | 6 |
| | Recorded: | 02/23/2023 | | |
| Attorney Dkt #: | P230214US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18022835
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Filing Dt:
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02/23/2023
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Publication #:
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Pub Dt:
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10/05/2023
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Title:
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ADHESIVE SHEET, SEMICONDUCTOR MODULE, AND METHOD FOR PRODUCING ADHESIVE SHEET
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Assignee
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| 110-1-1, FUNAYOSE, MARUOKA-CHO |
| SAKAI-SHI, FUKUI, JAPAN 910-0381 |
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Correspondence name and address
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WHDA, LLP
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8500 LEESBURG PIKE
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SUITE 7500
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TYSONS, VA 22182
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