Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062788/0945 | |
| Pages: | 5 |
| | Recorded: | 02/23/2023 | | |
| Attorney Dkt #: | 890102.507C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17531507
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Filing Dt:
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11/19/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Title:
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HIERARCHICAL DENSITY UNIFORMIZATION FOR SEMICONDUCTOR FEATURE SURFACE PLANARIZATION
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Assignee
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| 8, LI-HSIN RD. 6, |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SEED IP LAW GROUP
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701 5TH AVE
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STE 5400
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SEATTLE, WA 98104
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