Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 062884/0620 | |
| Pages: | 6 |
| | Recorded: | 03/05/2023 | | |
| Attorney Dkt #: | 2212289-I-US-CXMT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18152191
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Filing Dt:
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01/10/2023
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Publication #:
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Pub Dt:
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02/15/2024
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA 230601 |
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Correspondence name and address
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CHINA PAT INTELLECTUAL PROPERTY OFFICE
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2ND FLR., INTELLECTUAL PROPERTY BLD., #B
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NO.21 HAIDIAN SOUTH RD., HAIDIAN D.
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BEIJING, 100080 CHINA
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