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Reel/Frame:063011/0435   Pages: 3
Recorded: 03/17/2023
Attorney Dkt #:FP21-0483-00US-SDM
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18043582
Filing Dt:
03/01/2023
Publication #:
Pub Dt:
08/24/2023
Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE
Assignors
1
Exec Dt:
03/08/2023
2
Exec Dt:
03/11/2023
Assignee
1
13-9, SHIBA DAIMON 1-CHOME
MINATO-KU, TOKYO, JAPAN 105-8518
Correspondence name and address
SOEI USA INC.
1750 TYSONS BLVD, SUITE 1500
MCLEAN, VA 22102

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