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Reel/Frame:063077/0556   Pages: 10
Recorded: 03/23/2023
Attorney Dkt #:20110292/24061.3305US04
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18168065
Filing Dt:
02/13/2023
Publication #:
Pub Dt:
06/22/2023
Title:
INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF
Assignors
1
Exec Dt:
07/27/2016
2
Exec Dt:
04/17/2016
3
Exec Dt:
03/20/2017
4
Exec Dt:
01/23/2017
5
Exec Dt:
03/17/2017
6
Exec Dt:
03/23/2017
7
Exec Dt:
01/23/2017
8
Exec Dt:
01/20/2017
9
Exec Dt:
03/16/2017
10
Exec Dt:
05/20/2017
11
Exec Dt:
05/19/2016
12
Exec Dt:
05/19/2016
Assignee
1
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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