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Patent Assignment Details
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Reel/Frame:063095/0461   Pages: 6
Recorded: 03/24/2023
Attorney Dkt #:265681-517529
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18040765
Filing Dt:
02/06/2023
Publication #:
Pub Dt:
09/07/2023
Title:
COMPOSITE MOLDED COMPONENT
Assignors
1
Exec Dt:
12/26/2022
2
Exec Dt:
03/23/2023
3
Exec Dt:
12/22/2022
4
Exec Dt:
12/22/2022
Assignee
1
1-14, NISHISUEHIRO-CHO
YOKKAICHI-SHI, MIE, JAPAN 5108503
Correspondence name and address
HONIGMAN LLP
650 TRADE CENTRE WAY
SUITE 200
KALAMAZOO, MI 49002-0402

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