Patent Assignment Details
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| Reel/Frame: | 063399/0218 | |
| Pages: | 5 |
| | Recorded: | 11/18/2022 | | |
| Attorney Dkt #: | 1022.0139C |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS PREVIOUSLY RECORDED AT REEL: 057579 FRAME: 0997. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/03/2023
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Application #:
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17476132
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Filing Dt:
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09/15/2021
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Publication #:
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Pub Dt:
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03/24/2022
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Title:
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Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Substrate Processing Method
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Assignee
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| 3-4, KANDAKAJI-CHO, CHIYODA-KU |
| TOYKO, JAPAN 1010045 |
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Correspondence name and address
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EDELL, SHAPIRO & FINNAN, LLC
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9801 WASHINGTONIAN BOULEVARD
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SUITE 750
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GAITHERSBURG, MD 20878
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