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Reel/Frame:063410/0085   Pages: 11
Recorded: 04/23/2023
Attorney Dkt #:RESONAC_19
Conveyance: CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Total properties: 19
1
Patent #:
NONE
Issue Dt:
Application #:
17054167
Filing Dt:
11/10/2020
Publication #:
Pub Dt:
08/12/2021
Title:
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
2
Patent #:
NONE
Issue Dt:
Application #:
17255980
Filing Dt:
12/23/2020
Publication #:
Pub Dt:
04/22/2021
Title:
ANISOTROPIC CONDUCTIVE FILM AND METHOD FOR PRODUCING THE ANISOTROPIC CONDUCTIVE FILM INCLUDING A BASE MATERIAL HAVING RECESSES AND SOLDER PARTICLES FORMED INSIDE THE RECESSES
3
Patent #:
NONE
Issue Dt:
Application #:
17255982
Filing Dt:
12/23/2020
Publication #:
Pub Dt:
04/22/2021
Title:
SOLDER PARTICLES
4
Patent #:
NONE
Issue Dt:
Application #:
17255988
Filing Dt:
12/23/2020
Publication #:
Pub Dt:
07/29/2021
Title:
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
5
Patent #:
NONE
Issue Dt:
Application #:
17261571
Filing Dt:
01/20/2021
Publication #:
Pub Dt:
08/26/2021
Title:
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
6
Patent #:
Issue Dt:
04/23/2024
Application #:
17261877
Filing Dt:
01/21/2021
Publication #:
Pub Dt:
09/30/2021
Title:
ACRYLIC RESIN, PRODUCING METHOD THEREOF, RESIN COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE
7
Patent #:
NONE
Issue Dt:
Application #:
17262207
Filing Dt:
01/22/2021
Publication #:
Pub Dt:
09/23/2021
Title:
METHOD FOR DECOMPOSING FLAVONOID GLYCOSIDE AND METHOD FOR PRODUCING FLAVONOID
8
Patent #:
Issue Dt:
01/30/2024
Application #:
17263141
Filing Dt:
01/25/2021
Publication #:
Pub Dt:
06/24/2021
Title:
METHOD FOR DECOMPOSING FLAVONOID GLYCOSIDE AND METHOD FOR PRODUCING FLAVONOID
9
Patent #:
NONE
Issue Dt:
Application #:
17274788
Filing Dt:
03/10/2021
Publication #:
Pub Dt:
02/17/2022
Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
10
Patent #:
NONE
Issue Dt:
Application #:
17279594
Filing Dt:
03/25/2021
Publication #:
Pub Dt:
12/23/2021
Title:
ORGANIC ELECTRONIC MATERIAL AND USE THEREOF
11
Patent #:
NONE
Issue Dt:
Application #:
17279596
Filing Dt:
03/25/2021
Publication #:
Pub Dt:
11/04/2021
Title:
ORGANIC ELECTRONIC MATERIAL AND ORGANIC ELECTRONIC ELEMENT
12
Patent #:
Issue Dt:
02/06/2024
Application #:
17296986
Filing Dt:
05/26/2021
Publication #:
Pub Dt:
01/27/2022
Title:
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COPPER BONDING PASTE
13
Patent #:
NONE
Issue Dt:
Application #:
17422440
Filing Dt:
07/12/2021
Publication #:
Pub Dt:
03/24/2022
Title:
ANISOTROPIC HEAT-CONDUCTING RESIN MEMBER AND HEAT-TRANSMITTING SUBSTRATE
14
Patent #:
NONE
Issue Dt:
Application #:
17437412
Filing Dt:
09/08/2021
Publication #:
Pub Dt:
05/26/2022
Title:
CURABLE COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
15
Patent #:
NONE
Issue Dt:
Application #:
17601426
Filing Dt:
10/04/2021
Publication #:
Pub Dt:
06/23/2022
Title:
COATING LIQUID, COMPOSITE MATERIAL, AND COATING FILM
16
Patent #:
NONE
Issue Dt:
Application #:
17613493
Filing Dt:
11/23/2021
Publication #:
Pub Dt:
08/04/2022
Title:
COMPOUND, MOLDED ARTICLE, AND CURED PRODUCT
17
Patent #:
NONE
Issue Dt:
Application #:
17642229
Filing Dt:
03/11/2022
Publication #:
Pub Dt:
10/06/2022
Title:
ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART DEVICE
18
Patent #:
NONE
Issue Dt:
Application #:
17791534
Filing Dt:
07/08/2022
Publication #:
Pub Dt:
03/23/2023
Title:
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS
19
Patent #:
NONE
Issue Dt:
Application #:
17925014
Filing Dt:
11/14/2022
Publication #:
Pub Dt:
06/15/2023
Title:
PRIMER, SUBSTRATE EQUIPPED WITH PRIMER LAYER, METHOD FOR PRODUCING SUBSTRATE EQUIPPED WITH PRIMER LAYER, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
01/01/2023
Assignee
1
13-9, SHIBA DAIMON 1-CHOME, MINATO-KU,
TOKYO,, JAPAN
Correspondence name and address
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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