Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 063442/0638 | |
| Pages: | 16 |
| | Recorded: | 04/25/2023 | | |
Attorney Dkt #: | HITACHI5-1F |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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NONE
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Issue Dt:
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05/14/2024
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Application #:
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17053814
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Filing Dt:
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11/09/2020
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Publication #:
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Pub Dt:
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08/05/2021
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Title:
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MEMBER AND METHOD OF MANUFACTURING THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17183549
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Filing Dt:
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02/24/2021
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Publication #:
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Pub Dt:
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09/09/2021
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Title:
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SiC WAFER AND MANUFACTURING METHOD THEREOF
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Assignee
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6-36, TOYOSU 5-CHOME |
KOTO-KU |
TOKYO, JAPAN |
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Correspondence name and address
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VOLPE KOENIG
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30 SOUTH 17TH STREET, 18TH FLOOR
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PHILADELPHIA, PA 19103
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05/13/2024 08:34 AM
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