Patent Assignment Details
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| Reel/Frame: | 063448/0473 | |
| Pages: | 4 |
| | Recorded: | 04/26/2023 | | |
| Attorney Dkt #: | 17251SM-000006-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18304754
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Filing Dt:
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04/21/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Title:
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METHOD OF FORMING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING SYSTEM FOR FORMING SEMICONDUCTOR DEVICE
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Assignee
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| 77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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HARNESS, DICKEY & PIERCE, P.L.C.
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P.O. BOX 8910
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RESTON, VA 20195
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