Patent Assignment Details
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| Reel/Frame: | 063507/0251 | |
| Pages: | 3 |
| | Recorded: | 05/02/2023 | | |
| Attorney Dkt #: | TTAP 13524 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/02/2024
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Application #:
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18034972
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Filing Dt:
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05/02/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Title:
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FLUX AND SOLDER PASTE
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Assignee
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| 23, SENJU-HASHIDO-CHO, |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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BRIAN S. MYERS
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100 S. JEFFERSON ROAD
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SUITE 202
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WHIPPANY, NJ 07981
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04/29/2024 06:23 AM
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