Patent Assignment Details
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| Reel/Frame: | 063807/0977 | |
| Pages: | 5 |
| | Recorded: | 05/31/2023 | | |
| Attorney Dkt #: | 5521-0290PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18203792
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Filing Dt:
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05/31/2023
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Publication #:
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Pub Dt:
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12/14/2023
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Title:
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RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED SURFACE OF SUBSTRATE WITH SEMICONDUCTOR ELEMENT MOUNTED THEREON OR SEMICONDUCTOR ELEMENT-FORMING SURFACE OF WAFER WITH SEMICONDUCTOR ELEMENT FORMED THEREON, AND USE THEREOF
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Assignee
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| 4-1, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1000005 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLS CHURCH, VA 22042
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