Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 063832/0086 | |
| Pages: | 4 |
| | Recorded: | 06/01/2023 | | |
| Attorney Dkt #: | 052776-0084 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18039893
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Filing Dt:
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06/01/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
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Assignee
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| 23-23, HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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04/28/2024 07:48 PM
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