Patent Assignment Details
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| Reel/Frame: | 063875/0804 | |
| Pages: | 11 |
| | Recorded: | 06/07/2023 | | |
| Attorney Dkt #: | MNT-50989 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17263149
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Filing Dt:
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01/25/2021
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Publication #:
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Pub Dt:
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09/30/2021
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Title:
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SiC WAFER AND MANUFACTURING METHOD FOR SiC WAFER
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Assignees
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| 1-1, SHOWA-CHO, KARIYA-CITY |
| AICHI, JAPAN 4488661 |
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| 9-8, MEIEKI 4-CHOME, NAKAMURA-KU, NAGOYA |
| AICHI, JAPAN 4508575 |
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Correspondence name and address
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RANKIN, HILL & CLARK LLP
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23755 LORAIN ROAD, SUITE 200
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NORTH OLMSTED, OH 44070
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05/03/2024 01:41 PM
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