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Patent Assignment Details
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Reel/Frame:063951/0085   Pages: 3
Recorded: 06/14/2023
Attorney Dkt #:1012-3547 / 2021P05353 US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18137626
Filing Dt:
04/21/2023
Publication #:
Pub Dt:
11/02/2023
Title:
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Assignors
1
Exec Dt:
05/16/2023
2
Exec Dt:
05/23/2023
Assignee
1
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondence name and address
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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