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Reel/Frame:063970/0450   Pages: 4
Recorded: 06/16/2023
Attorney Dkt #:2020-2927/24061.4276US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18336137
Filing Dt:
06/16/2023
Publication #:
Pub Dt:
10/12/2023
Title:
MULTILAYER ISOLATION STRUCTURE FOR HIGH VOLTAGE SILICON-ON-INSULATOR DEVICE
Assignors
1
Exec Dt:
03/08/2021
2
Exec Dt:
03/10/2021
3
Exec Dt:
03/15/2021
4
Exec Dt:
03/16/2021
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU SCIENCE PARK, TAIWAN 300-78
Correspondence name and address
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE
DALLAS, TX 75219

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