Patent Assignment Details
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Reel/Frame: | 064059/0691 | |
| Pages: | 2 |
| | Recorded: | 06/26/2023 | | |
Attorney Dkt #: | KAMBIX-1008 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18214141
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Filing Dt:
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06/26/2023
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Publication #:
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Pub Dt:
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01/04/2024
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Title:
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OPTIMIZATION OF THE THERMAL PERFORMANCE OF THE 3D ICS UTILIZING THE INTEGRATED CHIP-SIZE DOUBLE-LAYER OR MULTI-LAYER MICROCHANNELS
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Assignee
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PO BOX 4484 |
ALBUQUERQUE, NEW MEXICO 87196-4484 |
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Correspondence name and address
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ORTIZ & LOPEZ, PLLC
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PO BOX 4484
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ALBUQUERQUE, NM 87196-4484
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05/15/2024 05:18 PM
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