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Reel/Frame:064117/0135   Pages: 4
Recorded: 06/29/2023
Attorney Dkt #:2482.1203
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18344314
Filing Dt:
06/29/2023
Publication #:
Pub Dt:
02/15/2024
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Assignor
1
Exec Dt:
06/14/2023
Assignee
1
1-1, TANABESHINDEN, KAWASAKI-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530
Correspondence name and address
STAAS & HALSEY LLP
1201 NEW YORK AVENUE, N.W.
WASHINGTON, DC 20005

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