Patent Assignment Details
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Reel/Frame: | 064120/0717 | |
| Pages: | 11 |
| | Recorded: | 06/15/2023 | | |
Attorney Dkt #: | 11042.1001 C2 US |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 056605 FRAME: 0673. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/15/2023
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Application #:
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17352961
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Filing Dt:
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06/21/2021
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Publication #:
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Pub Dt:
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10/07/2021
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Title:
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SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR DEVICE BASED ON MOLDING PROCESS
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Assignee
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66-68 SHUNYU ROAD, YUYAO CITY |
NINGBO, ZHEJIANG, CHINA 315400 |
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Correspondence name and address
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HARVEST IP LAW LLP
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1455 PENNSYLVANIA AVENUE NW, SUITE 400
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WASHINGTON, DC 20004
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