Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 064221/0719 | |
| Pages: | 4 |
| | Recorded: | 07/12/2023 | | |
| Attorney Dkt #: | S16023VN03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
18220891
|
Filing Dt:
|
07/12/2023
|
|
Publication #:
|
|
Pub Dt:
|
01/25/2024
| | | | |
|
Title:
|
MULTICHIP INTERCONNECTING PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
|
|
|
Assignee
|
|
|
|
|
| 349 FUXI ROAD, CHONGCHUAN DISTRICT, NANTONG, |
| JIANGSU PROVINCE, CHINA 226000 |
|
|
Correspondence name and address
|
| |
THE PL LAW GROUP, PLLC
|
| |
13800 COPPERMINE ROAD
|
| |
FL 1-3
|
| |
HERNDON, VA 20171
|
Search Results as of:
05/14/2024 04:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
