Patent Assignment Details
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| Reel/Frame: | 064259/0070 | |
| Pages: | 2 |
| | Recorded: | 07/14/2023 | | |
| Attorney Dkt #: | P24303US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/12/2015
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Application #:
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14240710
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Filing Dt:
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06/13/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER
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Assignee
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| 1-155, UEGAHARA-ICHIIBAN-CHO |
| NISHINOMIYA-SHI, HYOGO, JAPAN 662-8501 |
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Correspondence name and address
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WHDA, LLC
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8500 LEESBURG PIKE, SUITE 7500
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TYSONS CORNER, VA 22182
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