Patent Assignment Details
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Reel/Frame: | 064356/0721 | |
| Pages: | 3 |
| | Recorded: | 07/21/2023 | | |
Attorney Dkt #: | P24303US00 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE STREET ADDRESS OF RECEIVING PARTY TO , 1-55, UEGAHARA-ICHIBAN-CHO PREVIOUSLY RECORDED AT REEL: 064259 FRAME: 0070. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/12/2015
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Application #:
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14240710
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Filing Dt:
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06/13/2014
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Publication #:
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Pub Dt:
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10/30/2014
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Title:
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SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SEMICONDUCTOR WAFER
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Assignee
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1-155, UEGAHARA-ICHIBAN-CHO |
NISHINOMIYA-SHI, HYOGO, JAPAN 662-8501 |
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Correspondence name and address
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WHDA, LLC
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8500 LEESBURG PIKE, SUITE 7500
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TYSONS CORNER, VA 22182
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