Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064403/0465 | |
| Pages: | 10 |
| | Recorded: | 07/27/2023 | | |
| Attorney Dkt #: | TSMCP912USB |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18360185
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Filing Dt:
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07/27/2023
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Publication #:
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Pub Dt:
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11/16/2023
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Title:
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WAFER LEVEL IMAGE SENSOR PACKAGE
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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195 S. MAIN ST., SUITE 400
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AKRON, OH 44308
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05/02/2024 08:35 PM
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