Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064431/0046 | |
| Pages: | 7 |
| | Recorded: | 07/31/2023 | | |
| Attorney Dkt #: | 22468US01CON |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18361951
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Filing Dt:
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07/31/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Title:
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FABRICATING APPARATUS OF SIC EPITAXIAL WAFER AND FABRICATION METHOD OF THE SIC EPITAXIAL WAFER
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Assignee
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 6158585 |
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Correspondence name and address
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XSENSUS LLP
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100 DAINGERFIELD ROAD
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SUITE 402
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ALEXANDRIA, VA 22314
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