Patent Assignment Details
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| Reel/Frame: | 064496/0746 | |
| Pages: | 8 |
| | Recorded: | 08/04/2023 | | |
| Attorney Dkt #: | TSMCP1140USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18365561
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Filing Dt:
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08/04/2023
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Publication #:
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Pub Dt:
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11/23/2023
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Title:
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BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
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Assignee
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| NO. 8, LI-HSIN RD. 6 |
| HSIN-CHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK
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195 S. MAIN ST., SUITE 400
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AKRON, OH 44308
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05/13/2024 08:38 PM
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