Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064519/0366 | |
| Pages: | 7 |
| | Recorded: | 08/08/2023 | | |
| Attorney Dkt #: | 249/1414_00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18231339
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Filing Dt:
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08/08/2023
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Publication #:
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Pub Dt:
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02/29/2024
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Title:
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YTTRIUM COMPOUND, SOURCE MATERIAL FOR FORMING YTTRIUM-CONTAINING FILM, AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE USING THE SAME
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Assignees
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| 2-35, HIGASHIOGU 7-CHOME |
| ARAKAWA-KU, TOKYO, JAPAN |
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Correspondence name and address
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EUGENE M LEE
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LEE IP LAW, P.C.
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3141 FAIRVIEW PARK DRIVE, SUITE 500
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FALLS CHURCH, VA 22042
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04/27/2024 02:53 AM
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