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Reel/Frame:064584/0457   Pages: 3
Recorded: 08/15/2023
Attorney Dkt #:23087TBYX-0077-FPZZ27162
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/23/2024
Application #:
18449665
Filing Dt:
08/14/2023
Publication #:
Pub Dt:
04/04/2024
Title:
DEVICE AND METHOD FOR PREPARING THERMOSETTING BONDED MAGNET
Assignors
1
Exec Dt:
08/07/2023
2
Exec Dt:
08/07/2023
3
Exec Dt:
08/07/2023
4
Exec Dt:
08/07/2023
Assignee
1
NO.5 YIHEYUAN ROAD, HAIDIAN DISTRICT,
BEIJING, CHINA
Correspondence name and address
LEONG C. LEI
PMB # 1008
1839 YGNACIO VALLEY ROAD
WALNUT CREEK, CA 94598

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