Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064762/0436 | |
| Pages: | 3 |
| | Recorded: | 08/31/2023 | | |
| Attorney Dkt #: | SWKS 23229901(P3)US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18162419
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Filing Dt:
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01/31/2023
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Publication #:
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Pub Dt:
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08/03/2023
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Title:
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SHIELDED WAFER LEVEL CHIP SCALE PACKAGE WITH SHIELD CONNECTED TO GROUND VIA REDISTRIBUTION LAYERS
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Assignee
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| 5260 CALIFORNIA AVENUE |
| IRVINE, CALIFORNIA 92617 |
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Correspondence name and address
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DONALD BOLLELLA
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5221 CALIFORNIA AVENUE, 21-1
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IRVINE, CA 92617
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05/16/2024 08:02 PM
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