Patent Assignment Details
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| Reel/Frame: | 064890/0001 | |
| Pages: | 23 |
| | Recorded: | 09/13/2023 | | |
| Attorney Dkt #: | 749310 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/13/2024
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Application #:
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16759677
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Filing Dt:
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04/27/2020
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Publication #:
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Pub Dt:
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09/17/2020
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Title:
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COMPOSITION FOR CURABLE RESIN, CURED PRODUCT OF SAID COMPOSITION, PRODUCTION METHOD FOR SAID COMPOSITION AND SAID CURED PRODUCT, AND SEMICONDUCTOR DEVICE
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Assignee
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| 1-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8162 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD.
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TWO PRUDENTIAL PLAZA, SUITE 4900
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180 NORTH STETSON AVENUE
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CHICAGO, IL 60601-6745
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