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Reel/Frame:064913/0352   Pages: 12
Recorded: 08/31/2023
Attorney Dkt #:392739-00007
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED AT REEL: 038378 FRAME: 0301. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME.
Total properties: 78
1
Patent #:
7994636
Issue Dt:
08/09/2011
Application #:
10849947
Filing Dt:
05/20/2004
Publication #:
US20040212101
Pub Dt:
10/28/2004
Title:
FLIP CHIP INTERCONNECTION STRUCTURE
2
Patent #:
7968377
Issue Dt:
06/28/2011
Application #:
11162785
Filing Dt:
09/22/2005
Publication #:
US20070063322
Pub Dt:
03/22/2007
Title:
INTEGRATED CIRCUIT PROTRUDING PAD PACKAGE SYSTEM
3
Patent #:
7986043
Issue Dt:
07/26/2011
Application #:
11276646
Filing Dt:
03/08/2006
Publication #:
US20070210443
Pub Dt:
09/13/2007
Title:
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
4
Patent #:
7981702
Issue Dt:
07/19/2011
Application #:
11276647
Filing Dt:
03/08/2006
Publication #:
US20070210424
Pub Dt:
09/13/2007
Title:
INTEGRATED CIRCUIT PACKAGE IN PACKAGE SYSTEM
5
Patent #:
8026129
Issue Dt:
09/27/2011
Application #:
11276682
Filing Dt:
03/10/2006
Publication #:
US20070210432
Pub Dt:
09/13/2007
Title:
STACKED INTEGRATED CIRCUITS PACKAGE SYSTEM WITH PASSIVE COMPONENTS
6
Patent #:
8003443
Issue Dt:
08/23/2011
Application #:
11276684
Filing Dt:
03/10/2006
Publication #:
US20070212903
Pub Dt:
09/13/2007
Title:
NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE GROUND SITES
7
Patent #:
7977579
Issue Dt:
07/12/2011
Application #:
11278070
Filing Dt:
03/30/2006
Publication #:
US20070235215
Pub Dt:
10/11/2007
Title:
MULTIPLE FLIP-CHIP INTEGRATED CIRCUIT PACKAGE SYSTEM
8
Patent #:
8030755
Issue Dt:
10/04/2011
Application #:
11307532
Filing Dt:
02/10/2006
Publication #:
US20070108587
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH A HEAT SINK
9
Patent #:
7975377
Issue Dt:
07/12/2011
Application #:
11379011
Filing Dt:
04/17/2006
Publication #:
US20070109749
Pub Dt:
05/17/2007
Title:
WAFER SCALE HEAT SLUG SYSTEM
10
Patent #:
8009436
Issue Dt:
08/30/2011
Application #:
11380652
Filing Dt:
04/27/2006
Publication #:
US20070109757
Pub Dt:
05/17/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CHANNEL
11
Patent #:
7993939
Issue Dt:
08/09/2011
Application #:
11459325
Filing Dt:
07/21/2006
Publication #:
US20080017960
Pub Dt:
01/24/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LAMINATE BASE
12
Patent #:
7994619
Issue Dt:
08/09/2011
Application #:
11555682
Filing Dt:
11/01/2006
Publication #:
US20080111222
Pub Dt:
05/15/2008
Title:
BRIDGE STACK INTEGRATED CIRCUIT PACKAGE SYSTEM
13
Patent #:
8008770
Issue Dt:
08/30/2011
Application #:
11556035
Filing Dt:
11/02/2006
Publication #:
US20070114639
Pub Dt:
05/24/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BUMP PAD
14
Patent #:
8017502
Issue Dt:
09/13/2011
Application #:
11615929
Filing Dt:
12/22/2006
Publication #:
US20080153262
Pub Dt:
06/26/2008
Title:
WAFER SYSTEM WITH PARTIAL CUTS
15
Patent #:
8012867
Issue Dt:
09/06/2011
Application #:
11618647
Filing Dt:
12/29/2006
Publication #:
US20070178667
Pub Dt:
08/02/2007
Title:
WAFER LEVEL CHIP SCALE PACKAGE SYSTEM
16
Patent #:
8026593
Issue Dt:
09/27/2011
Application #:
11694907
Filing Dt:
03/30/2007
Publication #:
US20080237880
Pub Dt:
10/02/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS FOR PADS AND METHOD OF MANUFACTURING THEREOF
17
Patent #:
7985623
Issue Dt:
07/26/2011
Application #:
11735397
Filing Dt:
04/13/2007
Publication #:
US20070262473
Pub Dt:
11/15/2007
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONTOURED ENCAPSULATION
18
Patent #:
7977778
Issue Dt:
07/12/2011
Application #:
11744697
Filing Dt:
05/04/2007
Publication #:
US20080273312
Pub Dt:
11/06/2008
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERFERENCE-FIT FEATURE
19
Patent #:
8018052
Issue Dt:
09/13/2011
Application #:
11772044
Filing Dt:
06/29/2007
Publication #:
US20090001545
Pub Dt:
01/01/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SIDE SUBSTRATE HAVING A TOP LAYER
20
Patent #:
8008787
Issue Dt:
08/30/2011
Application #:
11857206
Filing Dt:
09/18/2007
Publication #:
US20090072377
Pub Dt:
03/19/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DELAMINATION PREVENTION STRUCTURE
21
Patent #:
7989931
Issue Dt:
08/02/2011
Application #:
11861926
Filing Dt:
09/26/2007
Publication #:
US20090079048
Pub Dt:
03/26/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH UNDER PADDLE LEADFINGERS
22
Patent #:
7977782
Issue Dt:
07/12/2011
Application #:
11936532
Filing Dt:
11/07/2007
Publication #:
US20090115032
Pub Dt:
05/07/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY
23
Patent #:
7985628
Issue Dt:
07/26/2011
Application #:
11954607
Filing Dt:
12/12/2007
Publication #:
US20090152706
Pub Dt:
06/18/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERCONNECT LOCK
24
Patent #:
7993979
Issue Dt:
08/09/2011
Application #:
11964567
Filing Dt:
12/26/2007
Publication #:
US20090166824
Pub Dt:
07/02/2009
Title:
LEADLESS PACKAGE SYSTEM HAVING EXTERNAL CONTACTS
25
Patent #:
8026582
Issue Dt:
09/27/2011
Application #:
12025745
Filing Dt:
02/04/2008
Publication #:
US20090194867
Pub Dt:
08/06/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADHESIVE
26
Patent #:
7993972
Issue Dt:
08/09/2011
Application #:
12042026
Filing Dt:
03/04/2008
Publication #:
US20090224391
Pub Dt:
09/10/2009
Title:
WAFER LEVEL DIE INTEGRATION AND METHOD THEREFOR
27
Patent #:
8018039
Issue Dt:
09/13/2011
Application #:
12043789
Filing Dt:
03/06/2008
Publication #:
US20090224389
Pub Dt:
09/10/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DEVICES
28
Patent #:
7989269
Issue Dt:
08/02/2011
Application #:
12047979
Filing Dt:
03/13/2008
Publication #:
US20090230531
Pub Dt:
09/17/2009
Title:
SEMICONDUCTOR PACKAGE WITH PENETRABLE ENCAPSULANT JOINING SEMICONDUCTOR DIE AND METHOD THEREOF
29
Patent #:
7989941
Issue Dt:
08/02/2011
Application #:
12051267
Filing Dt:
03/19/2008
Publication #:
US20090236751
Pub Dt:
09/24/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OVERHANG
30
Patent #:
7968981
Issue Dt:
06/28/2011
Application #:
12101915
Filing Dt:
04/11/2008
Publication #:
US20090258494
Pub Dt:
10/15/2009
Title:
INLINE INTEGRATED CIRCUIT SYSTEM
31
Patent #:
7968373
Issue Dt:
06/28/2011
Application #:
12114744
Filing Dt:
05/02/2008
Publication #:
US20090273094
Pub Dt:
11/05/2009
Title:
INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM
32
Patent #:
8030136
Issue Dt:
10/04/2011
Application #:
12121682
Filing Dt:
05/15/2008
Publication #:
US20090283870
Pub Dt:
11/19/2009
Title:
SEMICONDUCTOR DEVICE AND METHOD OF CONFORMING CONDUCTIVE VIAS BETWEEN INSULATING LAYERS IN SAW STREETS
33
Patent #:
8021907
Issue Dt:
09/20/2011
Application #:
12135830
Filing Dt:
06/09/2008
Publication #:
US20090302445
Pub Dt:
12/10/2009
Title:
METHOD AND APPARATUS FOR THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
34
Patent #:
8031475
Issue Dt:
10/04/2011
Application #:
12136007
Filing Dt:
06/09/2008
Publication #:
US20090016033
Pub Dt:
01/15/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEXIBLE SUBSTRATE AND MOUNDED PACKAGE
35
Patent #:
7977779
Issue Dt:
07/12/2011
Application #:
12136768
Filing Dt:
06/10/2008
Publication #:
US20090302452
Pub Dt:
12/10/2009
Title:
MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM
36
Patent #:
7969023
Issue Dt:
06/28/2011
Application #:
12142743
Filing Dt:
06/19/2008
Publication #:
US20090020893
Pub Dt:
01/22/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH TRIPLE FILM SPACER HAVING EMBEDDED FILLERS AND METHOD OF MANUFACTURE THEREOF
37
Patent #:
7968979
Issue Dt:
06/28/2011
Application #:
12146124
Filing Dt:
06/25/2008
Publication #:
US20090321898
Pub Dt:
12/31/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CONFORMAL SHIELDING AND METHOD OF MANUFACTURE THEREOF
38
Patent #:
7994645
Issue Dt:
08/09/2011
Application #:
12169342
Filing Dt:
07/08/2008
Publication #:
US20090014893
Pub Dt:
01/15/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE-IN-FILM ISOLATION BARRIER
39
Patent #:
8004093
Issue Dt:
08/23/2011
Application #:
12185063
Filing Dt:
08/01/2008
Publication #:
US20100025835
Pub Dt:
02/04/2010
Title:
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
40
Patent #:
7977780
Issue Dt:
07/12/2011
Application #:
12185067
Filing Dt:
08/01/2008
Publication #:
US20100025836
Pub Dt:
02/04/2010
Title:
MULTI-LAYER PACKAGE-ON-PACKAGE SYSTEM
41
Patent #:
7989950
Issue Dt:
08/02/2011
Application #:
12192052
Filing Dt:
08/14/2008
Publication #:
US20100038781
Pub Dt:
02/18/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING A CAVITY
42
Patent #:
7994624
Issue Dt:
08/09/2011
Application #:
12237344
Filing Dt:
09/24/2008
Publication #:
US20100072630
Pub Dt:
03/25/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ADHESIVE SEGMENT SPACER
43
Patent #:
8022538
Issue Dt:
09/20/2011
Application #:
12272747
Filing Dt:
11/17/2008
Publication #:
US20100123247
Pub Dt:
05/20/2010
Title:
BASE PACKAGE SYSTEM FOR INTEGRATED CIRCUIT PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
44
Patent #:
8022539
Issue Dt:
09/20/2011
Application #:
12272765
Filing Dt:
11/17/2008
Publication #:
US20100123227
Pub Dt:
05/20/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INCREASED CONNECTIVITY AND METHOD OF MANUFACTURE THEREOF
45
Patent #:
7994625
Issue Dt:
08/09/2011
Application #:
12273540
Filing Dt:
11/18/2008
Publication #:
US20100123232
Pub Dt:
05/20/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PROTRUSION AND METHOD OF MANUFACTURE THEREOF
46
Patent #:
7993941
Issue Dt:
08/09/2011
Application #:
12329458
Filing Dt:
12/05/2008
Publication #:
US20100140771
Pub Dt:
06/10/2010
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING Z-DIRECTION CONDUCTIVE POSTS EMBEDDED IN STRUCTURALLY PROTECTIVE ENCAPSULANT
47
Patent #:
7994629
Issue Dt:
08/09/2011
Application #:
12329467
Filing Dt:
12/05/2008
Publication #:
US20100140765
Pub Dt:
06/10/2010
Title:
LEADLESS INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
48
Patent #:
8017515
Issue Dt:
09/13/2011
Application #:
12332325
Filing Dt:
12/10/2008
Publication #:
US20100140752
Pub Dt:
06/10/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPLIANT POLYMER LAYER BETWEEN UBM AND CONFORMAL DIELECTRIC LAYER/RDL FOR STRESS RELIEF
49
Patent #:
7986048
Issue Dt:
07/26/2011
Application #:
12388516
Filing Dt:
02/18/2009
Publication #:
US20100207262
Pub Dt:
08/19/2010
Title:
PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTURE THEREOF
50
Patent #:
7977802
Issue Dt:
07/12/2011
Application #:
12398782
Filing Dt:
03/05/2009
Publication #:
US20100225007
Pub Dt:
09/09/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED DIE AND METHOD OF MANUFACTURE THEREOF
51
Patent #:
7989270
Issue Dt:
08/02/2011
Application #:
12404134
Filing Dt:
03/13/2009
Publication #:
US20100230806
Pub Dt:
09/16/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THREE-DIMENSIONAL VERTICALLY ORIENTED INTEGRATED CAPACITORS
52
Patent #:
7989356
Issue Dt:
08/02/2011
Application #:
12410260
Filing Dt:
03/24/2009
Publication #:
US20100244239
Pub Dt:
09/30/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING ENHANCED UBM STRUCTURE FOR IMPROVING SOLDER JOINT RELIABILITY
53
Patent #:
8022514
Issue Dt:
09/20/2011
Application #:
12410463
Filing Dt:
03/25/2009
Publication #:
US20090179314
Pub Dt:
07/16/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER SUPPORT
54
Patent #:
8003445
Issue Dt:
08/23/2011
Application #:
12412312
Filing Dt:
03/26/2009
Publication #:
US20100244232
Pub Dt:
09/30/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH Z-INTERCONNECTS HAVING TRACES AND METHOD OF MANUFACTURE THEREOF
55
Patent #:
8018040
Issue Dt:
09/13/2011
Application #:
12423320
Filing Dt:
04/14/2009
Publication #:
US20090194853
Pub Dt:
08/06/2009
Title:
SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF
56
Patent #:
8018034
Issue Dt:
09/13/2011
Application #:
12434367
Filing Dt:
05/01/2009
Publication #:
US20100276792
Pub Dt:
11/04/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING SHIELDING LAYER AFTER ENCAPSULATION AND GROUNDED THROUGH INTERCONNECT STRUCTURE
57
Patent #:
8026127
Issue Dt:
09/27/2011
Application #:
12467133
Filing Dt:
05/15/2009
Publication #:
US20090283893
Pub Dt:
11/19/2009
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SLOTTED DIE PADDLE AND METHOD OF MANUFACTURE THEREOF
58
Patent #:
8026128
Issue Dt:
09/27/2011
Application #:
12471180
Filing Dt:
05/22/2009
Publication #:
US20090250811
Pub Dt:
10/08/2009
Title:
SEMICONDUCTOR DEVICE AND METHOD OF SELF-CONFINEMENT OF CONDUCTIVE BUMP MATERIAL DURING REFLOW WITHOUT SOLDER MASK
59
Patent #:
7998790
Issue Dt:
08/16/2011
Application #:
12474757
Filing Dt:
05/29/2009
Publication #:
US20090302442
Pub Dt:
12/10/2009
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ISOLATED PADS AND METHOD OF MANUFACTURE THEREOF
60
Patent #:
7968995
Issue Dt:
06/28/2011
Application #:
12483087
Filing Dt:
06/11/2009
Publication #:
US20100314736
Pub Dt:
12/16/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF
61
Patent #:
7993976
Issue Dt:
08/09/2011
Application #:
12484143
Filing Dt:
06/12/2009
Publication #:
US20100317153
Pub Dt:
12/16/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING CONDUCTIVE VIAS WITH TRENCH IN SAW STREET
62
Patent #:
8004073
Issue Dt:
08/23/2011
Application #:
12486568
Filing Dt:
06/17/2009
Publication #:
US20100320619
Pub Dt:
12/23/2010
Title:
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF
63
Patent #:
8017501
Issue Dt:
09/13/2011
Application #:
12533160
Filing Dt:
07/31/2009
Publication #:
US20090291526
Pub Dt:
11/26/2009
Title:
SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIAS ON SAW STREETS FORMED WITH PARTIAL SAW
64
Patent #:
8021923
Issue Dt:
09/20/2011
Application #:
12533270
Filing Dt:
07/31/2009
Publication #:
US20090291527
Pub Dt:
11/26/2009
Title:
SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIAS ON SAW STREETS FORMED WITH PARTIAL SAW
65
Patent #:
8017521
Issue Dt:
09/13/2011
Application #:
12533344
Filing Dt:
07/31/2009
Publication #:
US20090291528
Pub Dt:
11/26/2009
Title:
SEMICONDUCTOR PACKAGE HAVING THROUGH-HOLE VIAS ON SAW STREETS FORMED WITH PARTIAL SAW
66
Patent #:
8021930
Issue Dt:
09/20/2011
Application #:
12540240
Filing Dt:
08/12/2009
Publication #:
US20110037155
Pub Dt:
02/17/2011
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING DAM MATERIAL AROUND PERIPHERY OF DIE TO REDUCE WARPAGE
67
Patent #:
8003496
Issue Dt:
08/23/2011
Application #:
12541334
Filing Dt:
08/14/2009
Publication #:
US20110037165
Pub Dt:
02/17/2011
Title:
SEMICONDUCTOR DEVICE AND METHOD OF MOUNTING SEMICONDUCTOR DIE TO HEAT SPREADER ON TEMPORARY CARRIER AND FORMING POLYMER LAYER AND CONDUCTIVE LAYER OVER THE DIE
68
Patent #:
7986032
Issue Dt:
07/26/2011
Application #:
12547439
Filing Dt:
08/25/2009
Publication #:
US20090309237
Pub Dt:
12/17/2009
Title:
SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS
69
Patent #:
7968996
Issue Dt:
06/28/2011
Application #:
12565698
Filing Dt:
09/23/2009
Publication #:
US20100001391
Pub Dt:
01/07/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORTED STACKED DIE
70
Patent #:
8008121
Issue Dt:
08/30/2011
Application #:
12612365
Filing Dt:
11/04/2009
Publication #:
US20110101512
Pub Dt:
05/05/2011
Title:
SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING SEMICONDUCTOR DIE TO OPPOSITE SIDES OF TSV SUBSTRATE
71
Patent #:
8034661
Issue Dt:
10/11/2011
Application #:
12625975
Filing Dt:
11/25/2009
Publication #:
US20110121449
Pub Dt:
05/26/2011
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPLIANT STRESS RELIEF BUFFER AROUND LARGE ARRAY WLCSP
72
Patent #:
7968445
Issue Dt:
06/28/2011
Application #:
12651758
Filing Dt:
01/04/2010
Publication #:
US20100105200
Pub Dt:
04/29/2010
Title:
SEMICONDUCTOR PACKAGE WITH PASSIVATION ISLAND FOR REDUCING STRESS ON SOLDER BUMPS
73
Patent #:
7973406
Issue Dt:
07/05/2011
Application #:
12716455
Filing Dt:
03/03/2010
Publication #:
US20100164100
Pub Dt:
07/01/2010
Title:
BUMP-ON-LEAD FLIP CHIP INTERCONNECTION
74
Patent #:
8018041
Issue Dt:
09/13/2011
Application #:
12759158
Filing Dt:
04/13/2010
Publication #:
US20100193926
Pub Dt:
08/05/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OFFSET STACKED DIE
75
Patent #:
8030769
Issue Dt:
10/04/2011
Application #:
12763390
Filing Dt:
04/20/2010
Publication #:
US20100200986
Pub Dt:
08/12/2010
Title:
GROOVING BUMPED WAFER PRE-UNDERFILL SYSTEM
76
Patent #:
8004095
Issue Dt:
08/23/2011
Application #:
12822080
Filing Dt:
06/23/2010
Publication #:
US20100258937
Pub Dt:
10/14/2010
Title:
SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTERCONNECT STRUCTURE FOR ENCAPSULATED DIE HAVING PRE-APPLIED PROTECTIVE LAYER
77
Patent #:
8022531
Issue Dt:
09/20/2011
Application #:
12880415
Filing Dt:
09/13/2010
Publication #:
US20100327418
Pub Dt:
12/30/2010
Title:
INTEGRATED CIRCUIT PACKAGE SYSTEM USING HEAT SLUG
78
Patent #:
8021924
Issue Dt:
09/20/2011
Application #:
12892907
Filing Dt:
09/28/2010
Publication #:
US20110018084
Pub Dt:
01/27/2011
Title:
ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF
Assignor
1
STATS CHIPPAC LTD.
Exec Dt:
03/29/2016
Assignee
1
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23
SINGAPORE, SINGAPORE
Correspondence name and address
KATTEN MUCHIN ROSENMAN LLP
1919 PENNSYLVANIA AVE., SUITE 800
WASHINGTON, DC 20006-3404

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