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Reel/Frame:065051/0536   Pages: 9
Recorded: 09/27/2023
Attorney Dkt #:2017-1173/24061.4659US02
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18341498
Filing Dt:
06/26/2023
Publication #:
Pub Dt:
11/09/2023
Title:
Low Warpage High Density Trench Capacitor
Assignors
1
Exec Dt:
09/08/2017
2
Exec Dt:
09/08/2017
3
Exec Dt:
09/08/2017
4
Exec Dt:
09/07/2017
5
Exec Dt:
09/26/2017
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
HAYNES AND BOONE, LLP
2323 VICTORY AVENUE
DALLAS, TX 75219

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